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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
The holiday season is in full swing for most of us; no matter which holiday you choose to recognize here in the second half of December, it’s almost certain that your routine has some level of interruption to it right now. Chances are, you might not be consuming as much of your usual diet of industry news and information, what with all the holiday treats and traditional meals to be consumed instead. That, gentle reader, is why we bring you this week’s Top 5 editor’s picks–your slimmed down version of the news, leaving you more time for the other delights of the season. So without further ado, we bring you the five news items you really should make room for this week.
And, as ever, the staff at I-Connect007 wish you a healthy, happy, joyous holiday season.
ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event
Published December 13
The best way to introduce this dispatch from the Institute of Circuit Technology’s Christmas Seminar, is to quote Pete Starkey’s opening paragraph:
“Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme.”
Starkey’s reporting from the technical conference field is highly sought after reading for so many of us, and this report does not disappoint. Definitely recommended reading.
Pan Pacific Microelectronics Symposium 2023 Program Finalized
Published December 14
The program for the 27th Annual Pan Pacific Microelectronics Symposium has been finalized. The event, which will take place from Jan. 30 to Feb. 1, 2023, at the Sheraton Kauai Resort on Kauai, Hawaii, promotes international technical interchange and provides a premier forum for global networking among microelectronics professionals and business. Read more here for details.
Physics, Electrical Engineering, and PCB Design
Published December 9
Tamara Jovanovic is a periodic contributor to Design007 magazine, and an insightful voice of the young PCB design professional. In this article, published in the November 2022 issue, which we themed “Maxwell vs. Moore: A Fight to the Physics,” Jovanovic delves into how her classroom education and her daily professional life intersect in useful and interesting ways. Readers definitely responded to her writing.
Industry Innovation Starts Here
Published December 9
If you haven’t already started planning your trip to IPC APEX EXPO in San Diego, then it’s definitely time to start. This news piece, courtesy the IPC conference staff, calls out six key reasons that you—or someone from your team—should be at the conference. Helpful tips for getting the greatest value for your registration dollar are included. Give it a read, then book your plane tickets.
EIPC: Europe’s Energy Disadvantage
Published December 15
In this interview, EIPC’s Alun Morgan details the unsettling realities facing the European PCB industry due to the current war in Ukraine, and outlines steps that the EIPC plans to take to help raise awareness of the possible perils the industry might face as a result.
Suggested Items
Advocacy: There’s No Time to Waste
05/21/2024 | Marcy LaRont, PCB007 MagazineIn the late 1990s, I worked for a PCB company ardently working to build manufacturing presences in Malaysia, Taiwan, and eventually China’s mainland. For some of us who had the resources, we followed our OEM customers offshore as they began demanding increasingly greater price concessions from their stateside suppliers. The government was not coming to the rescue of the PCB manufacturer, so we rode the changing economic tide as it turned unwaveringly toward globalism and cheaper labor.
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
05/21/2024 | Real Time with...IPC APEX EXPODevan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
TPCA Releases Guide to Help PCB Industry Achieve Low-Carbon Transformation
05/21/2024 | TPCAThe introduction of EU carbon tariffs, international brands committing to carbon neutrality, and the upcoming carbon fee in Taiwan means that carbon reduction is no longer just a slogan. Domestic and international pressures have turned carbon reduction into the golden grail of corporate sustainability.
SEMICON Europa 2024 Call for Abstracts Opens
05/21/2024 | SEMISEMI Europe announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.
American Standard Circuits/ASC Sunstone Circuits Showcase Cutting-edge Technology at PCB East 2024
05/21/2024 | American Standard CircuitsAmerican Standard Circuits (ASC) and ASC Sunstone Circuits are excited to announce their participation in PCB East 2024, a premier event for the printed circuit board and electronics design industry. The event will take place from June 4-6, 2024, at the Boxboro Regency Hotel and Conference Center in Boxborough, MA.