-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Kulicke & Soffa Appoints Fusen Chen as President and CEO
October 3, 2016 | Kulicke & Soffa Industries Inc.Estimated reading time: 2 minutes
Kulicke & Soffa, a provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments, has named Fusen Chen as president and CEO effective October 31, 2016. He was also elected to the Board of Directors of K&S, effective October 3, 2016. Jonathan Chou, CFO and interim CEO, will continue to serve as the CFO of the company.
"Fusen is the ideal person to lead K&S at this exciting and critical time for the company," said Garrett E. Pierce, Chairman of the Board of Directors. "The semiconductor equipment industry is experiencing rapid change. The need for form-factor reductions, performance improvements and energy efficiency result in greater semiconductor complexity requiring comprehensive Advanced Packaging solutions. While K&S continues to be the market leader in wire bonding, by leveraging its strong technological platform and strategically investing in R&D, the company is now well positioned to take advantage of these new Advanced Packaging growth opportunities. With his deep familiarity of the semiconductor equipment industry, strong understanding of the enabling technologies, proven track record in developing new products and driving revenue and profitability growth, Fusen has the experience, intellect and determination essential to further drive K&S growth and expansion. I would also like to thank Jonathan for his strong stewardship of the company over the last year."
"I'm incredibly excited and honored to join K&S," said Chen. "K&S has a proud history as a market and technology leader in the semiconductor equipment industry. I look forward to working with the highly talented employees of the company as we focus on executing new business growth and accelerating innovation of both new and core products to continue delivering maximum value to our customers, partners, employees and shareholders."
Fusen joins K&S from Mattson Technology, Inc. where he was the president and CEO. Under his leadership, the company turned around years of losses to generate significant revenue growth and achieved sustained profitability.
Fusen previously served as an executive vice president at Novellus Systems, with the responsibility for all semiconductor business units. Prior to this position, he was the chief technology officer (CTO) at Novellus, with the responsibility for defining the company’s technology strategy and direction. As the CTO, Fusen was Novellus’s primary executive interface with customers in Asia.
Prior to Novellus, Fusen spent 10 years at Applied Materials, most recently as the group vice president and general manager for the company’s copper physical vapor deposition and interconnect product business group. Before joining Applied Materials, he worked at LSI Logic and SGS-Thomson Microelectronics.
Fusen earned his Ph.D. degree in materials science and engineering from the State University of New York and a B.S. degree in material science and engineering from the Tsing Hua University in Hsinchu, Taiwan.
Suggested Items
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources: