-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dr. Jennie Hwang to Address Solder Joint Reliability and Role of Intermetallic Compounds at IMAPS
October 6, 2016 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products from commercial to military from computing to smartphone from medical to avionic applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intemetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.
On October 10, Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge of the industry by presenting on solder joint reliability and the role of intermetallic compounds at the upcoming IMAPS 2016 (49th International Symposium on Microelectronics) event, which will be held from October 10–13 in Pasadena, California. Dr. Hwang will discuss relevant aspects of solder joint reliability at Workshop B1 – "Reliability of Electronics – The Role of Intermetallic Compounds", and Workshop B2 – "Solder Joint Reliability - Principles and Applications". Attendees are encouraged to bring their own selected systems for deliberation.
Workshop B1 topics are as follows:
- Solder joint fundamentals – mechanical properties vs. microstructure evolution vs. services;
- Solder joint thermo-mechanical behavior and degradation – fatigue and creep interaction;
- Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack, and others;
- Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture;
- Solder joint strengthening metallurgy;
- Power of metallurgy for increased fatigue resistance and creep resistance;
- Distinctions and commonalties between Pb-free and SnPb solder joints;
- Thermal cycling conditions - effects on test results and test results interpretation;
- Testing solder joint reliability – discriminating tests and discerning parameters;
- Solder joint performance in harsh environments;
- What are on the horizon and what impact will be on reliability- present vs. future system;
- Best practices – competitive manufacturing (yield, cost, reliability);
- Ultimate reliability.
Workshop B1 topics are as follows:
- Intermetallic compounds – definition, fundamentals, and characteristics;
- Intermetallic compounds in the intrinsic material- Pb-free vs. SnPb;
- Formation and growth during production process and in product service life;
- Different types of intermetallic compounds – effects on solder joint reliability;
- Intermetallic compounds - at-interface vs. in-bulk;
- Effects from substrates (hybrid module thick film pads, PCB surface finish) + component coating;
- SAC alloys incorporated with various doping elements – characteristics, performance;
- Effects on failure mode;
- Effects on reliability.
For more information or to register, visit http://www.imaps.org/imaps2016/pdcs.htm#b1 and http://www.imaps.org/imaps2016/pdcs.htm#b2.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.