-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Packaging Solutions Survey Reveals Value Added Packaging is Strategic Brand Investment Area
November 7, 2016 | Jabil Circuit Inc.Estimated reading time: 2 minutes
Jabil Circuit Inc. has announced key findings from a recent survey of 200+ packaging industry decision makers. The survey, conducted by independent research firm, Dimensional Research, found nearly three-quarters (73 percent) of respondents say packaging is important to their brand experience and is a key area of investment according to 81 percent of executive-level respondents. Findings also indicated that adoption of advanced plastic packaging capabilities – such as "intelligent" packaging, e-commerce packaging, high barrier technologies and digital printing – is growing rapidly. Many respondents plan to adopt new types of plastic packaging in the next three years.
The survey revealed leading factors that influence the selection of plastic packaging suppliers. The top three cited by survey respondents were pricing that includes all product lifecycle costs, the ability to get products to market faster and advanced product design capabilities. Further, nearly a third want a supplier that can integrate smart packaging solutions, which enable enhanced customer engagement and brand loyalty.
“This research underscores the growing importance of innovative plastic packaging as a brand investment,” said Erich Hoch, CEO of Jabil Packaging Solutions. “Compelling capabilities and innovation make the difference for both brands and suppliers looking to set themselves apart. The brands want to squeeze as much value as they can from the packaging they choose.”
Another supplier selection criterion is the ability to use one vendor instead of multiple, geographically limited vendors. Almost three-quarters (74 percent) of packaging professionals who operate in multiple regions would prefer to work with a single supplier when launching a new product requiring custom packaging.
Download the full survey whitepaper at Trends in Plastic Packaging. Join Jabil Packaging Solutions for The Value Added Packaging Matters webinar series starting November 30. Register today at: Packaging Webinar.
About Jabil
Jabil is a product solutions company providing comprehensive electronics design, production and product management services to global electronics and technology companies. Offering complete product supply chain management from facilities in 28 countries, Jabil provides comprehensive, individualized-focused solutions to customers in a broad range of industries. Jabil common stock is traded on the New York Stock Exchange under the symbol, "JBL". Further information is available on Jabil's website: jabil.com.
About Jabil Packaging Solutions
Jabil Packaging Solutions, a division of Jabil, creates brand brilliance for the world's leading brands through technology leadership, manufacturing excellence and time-to-market advantages. From design to delivery, Jabil's value-added packaging solutions leverage a portfolio of highly engineered and proprietary processes to solve complex packaging requirements. By matching world-class offerings with an array of extended manufacturing capabilities, Jabil builds game-changing smart packaging solutions for customers.
Suggested Items
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Material Insight: The Importance of Standards for the Chip Packaging Industry
04/12/2024 | Dr. Preeya Kuray -- Column: Material InsightI had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across industry and academia to deliberate one of the most pressing technological matters of 2024: chip packaging standards.
Infineon, Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions
04/10/2024 | InfineonInfineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.
Indium’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan
04/02/2024 | Indium CorporationIndium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024).