-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
PD18 : Preventing Production Defects and Product Failures
February 7, 2017 | IPCEstimated reading time: 2 minutes
Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost, and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and product reliability issues through an understanding of potential causes is a necessity.
On Monday, February 13, from 9:00 to 12:00 pm, Dr. Jennie Hwang’s professional development course (PD18) at IPC APEX EXPO to be held at the San Diego Conference Center will address the top seven production defects and issues – PCB pad cratering (vs. pad lifting); BGA head-on-pillow defect; open or insufficient solder joints; copper dissolution issue; lead-free through-hole barrel filling, intermetallic compounds, and tin whisker. The role of intermetallics at-interface and in-bulk (contributing from the PCB surface finish/component coating) in relation to product reliability; the difference between SnPb and Pb-free solder joint in terms of intermetallic compounds, which in turn is attributed to production-floor phenomena and the actual field failure will be discussed. From practical perspectives, tin whisker with emphasis on risk mitigation through understanding the factors that affect tin whisker growth and its preventive and remedial solutions will be outlined. The practical tin whisker criteria for reliability implications in the lead-free environment and the relative effectiveness and the order of priority in mitigating measures will be ranked. Specific defects associated with BTCs and PoPs and the reliability of BTC and PoP assembly will also be outlined.
The course provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. The course is suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.
The main topics to be covered in this course are listed below. You are encouraged to bring your questions and issues for solutions and discussions.
Main Topics:
- Premise of production defects and product failure prevention;
- The list of common production defects and issues in lead-free assembly;
- Product reliability – principles;
- Product reliability – solder joint, PCB and component considerations;
- PCB pad cratering (vs. pad lifting) — causes and solutions;
- Open or insufficient solder Joints – different sources, best practices;
- BGA head-on-pillow defect — causes, factors, remedies;
- Copper dissolution – process factors, impact on through-hole joint reliability, mitigation;
- Lead-free through-hole barrel filling — material, process and solder joint integrity
- Defects of BTC and PoP solder joints – prevention and remedies;
- Intermetallic compounds – fundamentals, characteristics;
- Intermetallic compounds – effects on failure mode, solder joint reliability;
- Tin whisker – applications of concern, practical criteria, testing challenges;
- Tin whisker – growth phenomena, contributing factors, risk mitigation, practical remedies;
- Summary
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.