-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Super Dry to Launch Floor Life Reset Cabinets at SMT Hybrid Packaging 2017
March 21, 2017 | Super Dry TotechEstimated reading time: 2 minutes
Super Dry Totech, MSD handling specialist and global manufacturer of ultra low humidity drying and storage cabinets, introduces a new Floor Life Reset Cabinet for moisture sensitive devices, setting new standards in terms of flexibility and speed. The moisture management solution will be on display for the first time in May at SMT Hybrid Packaging 2017. Super Dry Totech will be in Booth 4-547.
Depending upon ambient humidity and temperature, components can be safely used only within a limited time period, as classified by the IPC/JEDEC J-Std- 033C. New and proven technologies can now safely reset component floor life using low temperatures and ultra-low humidity without requiring extensive time, but insufficient tracking and process control implementation can lead to haphazard component drying, particularly when multiple batches of different MSL level parts need to be accommodated.
The new Floor Life Reset Cabinets from Super Dry Totech bring an increased level of process control and multiple batch management to operations that do not have tracking software implemented.
The Reset cabinets can independently track the timing of four separate batches of components being reset at the same time. Two separate chambers, each with their own dry-unit and heater enable two different temperatures to be utilized in the same cabinet. Both compartments are insulated with 6mm walls.
Dehumidifying to less than 1% RH, both chambers have their own dry-unit and heater, so they can operate independently from each other. Low temperature Heat (40°C-60°C) is added to accelerate the drying time.
Each compartment features a 4" color display with countdown timers for MSL. Component batch ID and MSL level are entered directly at the cabinet, and standardized reset times are either automatically calculated and timed, or entered manually per internally developed procedures. The user simply selects the MSL level and Thickness. When the Floor life time has been reset, the user is notified, and the part is ready for use or for placing into a storage cabinet or Moisture Barrier bag (MBB).
All data can be tracked & recorded over time through an Ethernet connection and integrated software helping manufacturers on the path to achieving their industry 4.0 goals.
Among other systems on display on the SMT booth will be the company’s fully automated, robotically controlled, component handling and storage system, Dry Tower. Incorporating mature, proven MSD technology and wide ranging WMS-System integration capabilities, Dry Towers are capable of automatically managing tens of thousands of reels and trays and are totally modular for all mix and volume manufacturing scenarios.
Relevant information for processing components is data base managed, from robotic entry through storage or floor life reset, as well as retrieval and delivery of specified components for production from and to one, two or even ten or more different assembly locations.
The Super Dry Totech team will be on hand to explain to visitors how low humidity desiccant cabinets not only safely store components, but can also remove moisture and reset component floor life, while providing oxidation prevention equivalent to nitrogen at a fraction of the cost.
For more information visit www.superdry-totech.com.
Suggested Items
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.