-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
YAMAHA Launches Advanced Hybrid AOI System
October 4, 2017 | Yamaha Motor Co., Ltd.Estimated reading time: 1 minute
YAMAHA has launched its YSi-V 12M Type HS2 high-end hybrid AOI system, which offers faster inspection speed, higher precision, and enhanced capacity and performance for specular components.
Development of the YSi-V 12M Type HS2 targeted faster processing through improved image processing hardware and image inspection algorithms; as a result, it has achieved more than 25% increase in 3D inspection speed when compared to the existing model, and delivers a significant speed increase of up to 40% for PCBs with high component mounting density.
New features include a high-precision mode, enabling capture of clear three-dimensional images. The high-precision 7 μm resolution camera includes an all-new design dedicated 3D image capture projector optical system, significantly improving form reproducibility of extremely small-sized components down to 008004 size, and increasing height measurement repeatability. In addition, the optimization of image capture parameters and the use of newly-developed algorithms has enabled inspection capacity and performance compatible with thin, highly-integrated WLCSP and FOWLP components, whose use has risen dramatically since last year.
The YSi-V 12M Type HS2 is user-friendly and quick to program, but also offers the customer greater flexibility. For example, the user can decrease 3D speeds, allowing the user to either reduce cycle time or increase 3D inspection, resulting increased inspection capability. This allows more flexibility for the customer by allowing more programming options.
Notable features include the following:
- Foreign Object Detection;
- IPC Rank Tuning, i.e., Automatic tuning of Components based on IPC Class.
- Judgement Criteria Tuning, i.e., automatic tuning based on ‘golden boards’;
- Side View Inspection to check leads on connectors that can’t be seen from a top view;
- 2000 predefined libraries that provide ease of programming;
- SPC Analysis Tool;
- Marker Frame, a feature to let a marker pen automatically assign a code to the board for traceability;
- Z-axis Warpage Compensation;
- QA Option – Communication feedback between AOI and Mounter to determine root cause of defects
About Yamaha Motor Corporation, USA
Yamaha Motor Corporation, USA offers a full line of machines for electric/electronic parts mounting, printing, inspection, and other production-line solutions to answer the diversifying needs of today’s electronics manufacturers. Yamaha Motor has sales and service offices in Japan, China, Southeast Asia, Europe, Brazil, and North America, providing a truly global sales and service network, delivering best in class on-site sales and service support for their customers. For more information, click here.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.