-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Keith Bryant to Present on Behalf of YXLON International at productronica
October 18, 2017 | YXLON InternationalEstimated reading time: 3 minutes
YXLON International, a company of the Swiss tech holding, Comet Group, is pleased to announce that Keith Bryant, Global Director Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.
Additionally, Bryant will discuss metrology, which is just starting to be possible at this level, due to the high precision manipulation systems and the granite bases of these new systems. The FF35 CT brings a new dimension to electronics X-ray, allowing users to benefit from technology revolutionary in our industry.
Manufactured in Germany, the YXLON FF35 CT brings NDT (Non-Destructive Test) expertise to the micro-electronics world, allowing wafer-level CT up to complete assembly CT, taken as a single image, but the operator can easily drill down to sub-micron level in the 3D reconstruction. Reconstruction happens in parallel, so it works very quickly, using market-leading software ensures even sub-micron features can be viewed and measured easily. The high-resolution FF35 CT system as well as the other Yxlon X-ray and CT systems dedicated for the electronics market can be visited at productronica booth 405 in hall A2. Visitors can bring parts in order to experience the capabilities of the Yxlon X-ray and CT systems.
Bryant has more than 25 years of successful experience at a senior level in technical sales, primarily in the X-ray field. He is responsible for all YXLON channels to market, and developing the company’s global sales team to be even closer to its customers, understanding their needs and reacting promptly.
About YXLON
YXLON International designs and produces radioscopic and CT inspection systems for the widest variety of applications and fields. Whether situated in the aviation & aerospace, automotive or electronics industry, our customers are among the largest producers, major enterprises that place their confidence in our quality worldwide.
The name YXLON stands for assurance and quality for all types of cast parts, tires, electronic components, turbine blades, welded joints and a lot more. Our product portfolio includes X-ray systems for installation in radiological inspection envelopes, universal X-ray inspection systems on the basis of fully shielded devices, as well as solutions specific to a customer. Whether in manual, semi or fully automated operation, our inspection systems are ideal for deployment in research & development and can be integrated into any production process.
With our FeinFocus product line we offer microfocus systems for detailed insights into even finer structures. If semiconductor packaging, BGA soldering joints on printed circuit boards, sensors or relays – with 2D or 3D inspection missing or damaged bonding wires, flawed soldering joints or splices as well as other manufacturing defects can be detected and their position and size defined according to requirements.
With our headquarters in Hamburg, sales and service locations in Tokyo, Osaka, Hudson (Ohio), San Jose (California), Beijing, Shanghai, Hattingen and Heilbronn, as well as a network of representatives in over 50 countries, as YXLON we’re local for our customers all over the world.
Since 2007, YXLON International has been a member of the Comet Group.
About Comet Group
The Comet Group is a globally leading, innovative Swiss technology company with a focus on the x-ray, radio frequency and ebeam businesses. With premium high-tech components and systems, we enable customers in numerous industries to both enhance the quality of their products and make their manufacturing more efficient and eco-friendly. Our innovative solutions under the Comet, Yxlon and ebeam brands are in demand for applications such as materials testing and security inspection, the coating and treatment of surfaces, and non-contact sterilization.
Based in Flamatt, Switzerland, the Comet Group has a presence in all world markets. We employ about 1,300 people worldwide, including almost 500 in Switzerland. Besides production facilities in China, Denmark, Germany, Switzerland and the USA, we maintain various subsidiaries in the USA, China, Japan and Korea. Comet’s stock (COTN) is listed on the SIX Swiss Exchange.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.