-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Balver Zinn Group at productronica 2017
October 26, 2017 | Balver Zinn GroupEstimated reading time: 1 minute
The Balver Zinn Group announces that they will be attending Productronica scheduled to take place November 14-17 in Munich, Germany. The Balver Zinn Group will highlight the company’s latest solder technology and services in hall 4, booth #261.
As the licensee we present Nihon Superiors newly patented SN100CV lead-free micro-alloyed solder. The industry standard SN100C has been proven as the one of the best Silver-free Lead-free solder. Now Nihon Superior has developed remarkable new lead-free solder alloy by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV alloy offers high reliable solder joints for a lower price compared to Ag-containing alloys.
SN100CV has all the advantages that have made SN100C so popular, including reduced copper dissolution rates. The lower surface tension of the solder and less surface oxidation related to the germanium, will provide better wetting and flow properties.
Balver Zinn has over 13 years of experience in manufacturing SN100C and can rely on an extensive global partner network. In 2013 Balver Zinn has been granted the right to sub-license the SN100C patent by Nihon Superior Co. Ltd.
During the Productronica show Keith Sweatman from Nihon Superior Co. Ltd. will be present at the Balver Zinn booth to provide support whenever special attention is needed to optimize the SN100C processes. Keith Sweatman is graduate in metallurgical engineering and since 2001 he has been assisting Nihon Superior Co, Ltd. and development of their global business in lead-free solders.
Also at the Productronica show will be Cobar OT2M and BSA04-XSP solder paste along with B2012 solder wire and the extensive range of Cobar solder fluxes.
About the Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.