-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young Expands AOI Capabilities to Backend Process
November 9, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology will demonstrate new backend process AOI capabilities with the KY-P3 3D pin inspection solution at productronica 2017, which will be held on November 14-17 in Munich, Germany. Koh Young will be in Hall A2 Booth 377.
Using its world-class 3D AOI technology as the foundation for development, Koh Young designed the KY-P3 to overcome longstanding industry challenges like lengthy programming time and high false call rates. Following its guidance, the new Koh Young KY-P3 delivers true 3D inspection data for single array, forked, press-fit and more pin configurations as well as applications like Final Optical Inspection (FOI) for engine control units. The system also measures pin height, solder height and pin tip separation with accuracy and repeatability.
Beyond pin measurement and inspection capabilities, the new KY-P3 incorporates the latest technologies to make programming faster and easier. The Koh Young Artificial Intelligence-driven Auto Programming software allows users to quickly generate inspection condition setting using our leading-edge Artificial Intelligence engine and optimized graphical user interface.
The known leader in electronics measurement and inspection, Koh Young is expanding its technology beyond the PCB industry. For example, the new MOI (Machining Optical Inspection) system is quickly being adopted by some of the industry’s largest smartphone makers. Koh Young is achieving its guiding vision “Measure Everything, Everywhere.”
As the absolute leader in the SPI and AOI market, Koh Young will display a broad display innovations, as well as participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 377 in hall A2, you can learn more about Koh Young Technology and its best-in-class inspection solutions here.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.