-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Ersa to Introduce Rework and Soldering Systems at IPC APEX EXPO
January 2, 2019 | ErsaEstimated reading time: 1 minute
Kurtz Ersa Inc. will exhibit at IPC APEX EXPO 2019, scheduled to take place January 29-31, 2019 at the San Diego Convention Center in California. The company will introduce the HR 600 XL and the VERSAFLOW 4XL with VERSAFLEX in booth 2706.
With the Ersa HR 600 XL, it is possible to professionally rework BTC components on big board assemblies. Boasting a heated area of 24 x 24 inch and a PCB thickness of up to 10 mm opens up rework capabilities in the segments of telecommunication, network and infrastructure.
The HR 600 XL features a bottom-side IR Matrix heater with a total power of 15 kW that consists of 25 individually controllable heating elements. For each application the ideal heat distribution can be set. The highly efficient 800 W hybrid heating head executes the component desoldering or installation from chip resistors to 60x60 mm (2.36x 2.36 inch) BGAs or sockets in well-known Ersa quality.
The VERSAFLOW 4XL is designed for PCB sizes of up to 610 x 1,200 mm. This selective soldering system provides a revolutionary new dimension of flexibility and application variety – at the highest soldering quality.
Printed circuit board (PCB) formats of up to 610x1,200 mm can be soldered efficiently and safely with the VERSAFLOW 4XL, making it a perfect system for large, highly integrated assemblies or LED applications. Featuring the completely new VERSAFLUX flux module and VERSAFLEX solder module, the VERSAFLOW 4XL is extremely flexible and manages most diverse solder jobs.
Ersa also will display the VERSAFLOW 455 selective soldering system, Smartflow 2020 selective soldering system, N2 Generator, Hotflow 3/20 reflow oven, Powerflow Air, VERSAPRINT Ultra with the latest measuring technology via 3D camera, and HR550 & HR600/2 rework systems. Additionally, the company will show automation solutions (conveyors, lifts, etc.), as well as hand tools.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation are proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia. on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.