-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young Technology to Highlight Next-Level Connectivity at IPC APEX EXPO 2019
January 22, 2019 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, the industry’s leading smart factory solutions provider, will highlight latest process optimization solution with its KY8030-3 3D SPI for solder paste printing at IPC APEX EXPO 2019 show during 29-31 January 2019 at the San Diego convention center. The Koh Young Process Optimizer (KPO) solution is a comprehensive process optimization solution suite, which maximizes throughput and increases ROI by recommending optimal print parameters.
The Koh Young Process Optimizer (KPO), which recently accepted the award for Best Process Control Software at the Mexico EMS Technology Award ceremony, is Koh Young’s long-awaited realization of the desire to contribute to the evolution of industrial innovations. KPO, comprised of several interlinking software modules, automatically analyzes SPI data in real-time, recommends print parameters based on DOE results, and alerts operators to print process issues with real-time AI-based monitoring of SPI results. An intuitive, graphical user interface puts real-time data analytics at the forefront (Figure 1).
Figure 1: Example images of the KPO software User Interface
By incorporating Koh Young’s true 3D measurement data, KPO allows manufacturers to quantitatively manage printer settings and optimization time without highly experienced operators. Beyond its industry-leading accuracy, KPO verifies DOE-tested parameters with new DOE Reliability Report; which shows how reliable conducted DOE is before recommending the optimal parameters. The engine also allows the user to remove and rerun outliers to enhance the reliability and the fitness of DOE modelling. With KPO, SPI goes far beyond catching good board/bad board.
Moreover, Koh Young will also show the latest KSMART solution, which leverages true 3D measurement data to help manufacturers operate lines more efficiently. For instance, the LM@KSMART (Library Manager) module simultaneously deploys stored programs and inspection conditions across multiple lines, while RTM@KSMART (Real Time Monitoring) displays relevant process parameters to remote locations for immediate analysis. The latest KSMART solution performs with improved usability and versatility, where users can simply click through menus to drill down into details for the information needed.
As the absolute leader in the SPI and AOI market with over 13,000 machines delivered worldwide, Koh Young will showcase a broad set of its latest developments, including the new KY-P3 pin inspection solution and Meister D semiconductor solution. Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 1908.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.