-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Latest Conference Proceedings Now Available in SMTA Knowledge Base
February 8, 2019 | SMTAEstimated reading time: 1 minute
The 2018 Technical Conference Proceedings from the SMTA International Conference and Exhibition (SMTAI) and International Wafer-Level Packaging Conference (IWLPC) are now available for download from the SMTA Knowledge Base.
"This is your source for the latest and highest quality information and research on electronics manufacturing and advanced packaging," stated Ryan Flaherty, SMTA director of communications, in making the announcement. “You can download more than 100 papers that were presented in the technical sessions last fall at SMTA International, and over 30 papers from IWLPC.”
Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.
The SMTA International Conference and Exhibition (SMTAI) 2019 will be held September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, Illinois, USA.
The next International Wafer-Level Packaging Conference will be held on October 22-24, 2019 at the DoubleTree by Hilton San Jose in San Jose, CA, USA.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Foxconn Pledges 100% Renewable Electricity by 2040, Joins RE100
04/22/2024 | FoxconnHon Hai Technology Group announced its worldwide operations will run fully on green electricity by 2040 and has joined the global initiative RE100, in a milestone on Earth Day 2024 that adds the world’s largest electronics manufacturer and technology solution provider among the most influential businesses committed to 100% renewable electricity.
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
IDTechEx Examines the Opportunities for Wearables in Digital Health
04/19/2024 | IDTechExIDTechEx’s report, “Digital Health and Artificial Intelligence 2024-2034: Trends, Opportunities, and Outlook”, covers this ongoing trend in the consumer health wearables market and includes analysis of the opportunities and roadmap for biometric monitoring.
RTX Signs Largest Renewable Electricity Deal with ENGIE
04/19/2024 | RTXRTX announced an agreement with a subsidiary of ENGIE North America (ENGIE) that will provide 100% renewable electricity to 12 of the company’s Texas facilities.
Cicor Shareholders Approve All Proposals
04/19/2024 | Cicor Technologies Ltd.At the Annual General Meeting of Cicor Technologies Ltd. in Zurich, the shareholders approved all proposals.