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iNEMI Schedules Smart Manufacturing Session at SEMICON West
June 20, 2019 | iNEMIEstimated reading time: Less than a minute
Join iNEMI in San Francisco on July 9, from 10:00 a.m. to noon, at SEMICON West (Moscone Center). We are hosting a meeting that will highlight iNEMI’s Smart Manufacturing roadmap and include a brainstorming session on potential new projects in the areas of back-end commonality (packaging, inspection, test and more).
Brainstorming topics will include advanced packaging (media, tools optimization), data analytics, etc. Confirmed attendees include Intel, AMD, Rudolph, KNS, Cimetrix, Jabil, ASM, SEMI and others. Please contact Urmi Ray, by June 30 if you want to attend.
Suggested Items
Altair Acquires Cambridge Semantics, Powering Next-Generation Enterprise Data Fabrics and Generative AI
04/22/2024 | AltairAltair a global leader in computational intelligence, acquired Cambridge Semantics, a modern data fabric provider and creator of one of the industry’s leading analytical graph databases.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.