-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Universal's APL Shares AREA Consortium Research at SMTAI
September 12, 2019 | Universal Electronics Inc.Estimated reading time: 2 minutes
Universal Instruments’ Advanced Process Lab (APL) will be exhibiting on booth #1215 at the SMTA International 2019 Exhibition in Rosemont, Illinois, September 24–25. Experts from the APL will be on hand to discuss current and next-generation technology challenges with attendees. The APL will also present at multiple technical sessions on topics derived from the ongoing research of the APL’s Advanced Research in Electronics Assembly (AREA) Consortium during the four-day conference, taking place on September 22–26.
On Tuesday, September 24 at 2:00 p.m., as a component of Session MFX2: Reflow Challenges, Auburn University graduate research assistant for the APL’s AREA Consortium, Arvind Srinivasan Karthikeyan will present a paper, entitled "Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components" that explores the phenomenon of solder joint bridging in fine-pitch BGA components reflowed under vacuum.
On Thursday, September 26 at 1:00 p.m., as a component of Session LF3: Low Temperature Solder, Binghamton University graduate research assistant for the APL’s AREA Consortium, Faramarz Hadian will present a paper entitled "Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy." This paper examines the migration of Bi in Sn-Bi solder joints under prolonged current flow and the possible consequences on mechanical properties and joint reliability.
Also on Thursday, September 26, at 3:30 p.m., as a component of Session LF4: Lead-Free Reliability II, AREA Consortium Manager and SMTA Distinguished Speaker, Jim Wilcox will present a paper entitled "Assessment of the Behavior of High Reliability Solder Alloys in Accelerated Thermal Testing." This paper will address the demand for Pb-free solder alloys that exhibit superior performance in harsh environments by examining the microstructural evolution of two different high-reliability solder alloys in both accelerated thermal cycling and accelerated thermal shock testing. Wilcox will also co-chair Session APT4: Wafer-Level Packaging on Wednesday, September 25.
“We’ve been presenting at SMTA International for many years and each year, it continues to evolve and get even better,” said APL Director, David Vicari. “It is the perfect forum to exchange leading-edge knowledge and ideas with the brightest people in our industry, as well as offering the opportunity to mingle with some of our closest friends—both old and new—in the electronics community. Every year, we learn something new that we can apply in our own research and business objectives and, hopefully, we help some of our peers at the show do the same.”
The two-day exhibition will host more than 170 companies representing every facet of the industry. The conference features 15 professional development courses, 120 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.