-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dr. Jennie Hwang to Address “Reliability of Electronics - The Role of Intermetallic Compounds” at IPC APEX, Feb. 3 at 9 AM
January 10, 2020 | Dr. Jennie HwangEstimated reading time: 3 minutes
Intermetallic compounds (IMCs) play an increasingly critical role in the performance and reliability of solder interconnections in the chip level, package level and board level of lead-free electronics.
Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge to address “Reliability of Electronics - the Role of Intermetallic Compounds” on Monday, February 3, from 9:00 to 12:00 p.m. in the professional development course (PD13) at IPC APEX to be held at the San Diego Conference Center.
PD13: “Reliability of Electronics - the Role of Intermetallic Compounds”
With the goal to produce reliable products while achieving high yield production, this course focuses on one of likely product failure processes that are induced or aggravated by time, temperature and/or stress - intermetallic compounds.
This course covers the relevant and important aspects of intermetallic compounds ranging from scientific fundamentals to practical application scenarios. Intermetallic compounds before solder joint formation, during solder joint formation and after solder joint formation in storage and during service will be examined. Intermetallics at-interface and in-bulk, as well as the role of PCB surface finish/component coating in relation to intermetallics, in turn, to the reliability, will be discussed. The difference between SnPb and Pb-free solder joint in terms of intermetallic compounds, which affects production-floor phenomena and the actual field failure, will be outlined. The course will also address the relevant aspects of “newer” Pb-free alloys that were recently introduced to the market. The course emphasizes practical, working knowledge, yet balanced and substantiated by science. Attendees are welcome to bring their own selected systems for deliberation.
Please join your industry colleagues in this course.
Topics:
• Intermetallic compounds " definition, fundamentals, characteristics
• Phase diagrams of Pb-free solders in contrast with SnPb
• Intermetallic compounds in the intrinsic material- Pb-free vs. SnPb
• Formation and growth during the production process and during the product service life
• Intermetallic compounds - at-interface vs. in-bulk
• Effects from substrate compositions (hybrid module thick film pads, PCB surface finish, component surface coating)
• Gold embrittlement
• Different types of intermetallic compounds " effects on solder joint reliability (Ni/Au, Ni/Pd/Au, Ni/Pd, Cu)
• SAC alloys incorporated with various doping elements " characteristics, performance
• “Low-Temperature” solder alloys " critical areas to product reliability
• Effects on failure mode
• Effects on reliability.
Who should attend? The course provides working knowledge and pragmatic perspectives to all who are concerned about the reliability or interested in understanding the solder joint behavior in relation to intermetallic compounds, including designers, researchers, managers, quality, manufacturing and reliability professionals.
Registration: PD-13
Info: AndreaKeefe@ipc.org
About Dr. Jennie S. Hwang
Dr. Jennie S. Hwang—an international businesswoman and speaker, and business and technology advisor—is a pioneer and long-standing contributor to electronics hardware manufacturing as well as to the environment-friendly lead-free electronics implementation. Among her many awards and honors, she was inducted to the International Hall of Fame—Women in Technology, elected to the National Academy of Engineering, an R&D-Stars-to-Watch, and YWCA Achievement Award. Having held senior executive positions with Lockheed Martin Corp., Sherwin Williams Co., SCM Corp, and CEO of International Electronic Materials Corp., she is currently CEO of H-Technologies Group providing business, technology, and manufacturing solutions. She is the Chairman of the Assessment Board of the DoD Army Research Laboratory, serving on Commerce Department’s Export Council, National Materials and Manufacturing Board, NIST Assessment Board, Army Science and Technology Board, various national panels/committees, international leadership positions, and the board of Fortune-500 NYSE companies and civic and university boards. She is the author of 500+ publications and several books, and a speaker and author on trade, business, education, and social issues. Her formal education includes four academic degrees as well as the Harvard Business School Executive Program and Columbia University Corporate Governance Program.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.