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TopLine Awarded US Patent for CCGA Fixture
March 4, 2020 | TopLineEstimated reading time: Less than a minute
TopLine Corporation announced today that Martin Hart, CEO of TopLine and inventor, has been awarded US Patent D874,413 S for a fixture designed to deliver 1752 solder columns onto a substrate as part of the Ceramic Column Grid Array (CCGA) assembly process. The patent was awarded on February 4, 2020.
TopLine’s innovative CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html. For more information about CCGA, visit www.CCGA.co.
In addition to CCGA solutions, TopLine also manufactures Daisy Chain test components, Zero Ohm PCB jumpers and engineering evaluation kits for experimentation. TopLine also makes vibration dampers to extend the life of PCB assemblies. For more information, visit www.topline.tv.
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03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
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Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.