-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Corporation Engineers Earn SMTA Certification
June 25, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation is proud to announce that members of its United States-based technical support team have earned SMTA certification.
Two Technical Support Engineers have recently earned certification as Certified SMT Process Engineers (CSMTPE): Meagan Sloan and Miloš Lazi?.
They join a number of CSMTPE colleagues at Indium Corporation, including two fellow United States-based technical support team members: Adam Murling, Technical Support Engineer II and Lean Six Sigma Green Belt; and Kimberly Flanagan, Technical Support Engineer II.
SMTA's CSMTPE Certification is a unique program that is sponsored by the Surface Mount Technology Association (SMTA), which recognizes and certifies competence across the entire SMT assembly process at an engineering level. This certification is one of the electronics assembly industry's most respected validations of process excellence.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
Suggested Items
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
The Connection Between Wire Harness and Box Build
04/17/2024 | Nolan Johnson, I-Connect007Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.