-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Siemens and SAP Join Forces to Accelerate Industrial Transformation
July 14, 2020 | PR NewswireEstimated reading time: 2 minutes
Siemens and SAP SE announced a new partnership that will leverage their industry expertise and bring together their complementary software solutions for product lifecycle, supply chain and asset management so their customers can deliver new innovation and collaborative business models that will accelerate industry transformation globally. Through this agreement, both SAP and Siemens will be able to complement and integrate their respective offerings in order to offer customers the first truly integrated and enhanced solutions for product lifecycle management (PLM), supply chain, service and asset management. This will enable customers to form a true digital thread integrating all virtual models and simulations of a product or asset with real-time business information, feedback and performance data over the entire lifecycle.
"Digital transformation will be critical for the manufacturing industries to increase productivity, flexibility and accelerate innovation, so companies must come together in new ways to enable the digital enterprise," said Klaus Helmrich, Member of the Managing Board of Siemens AG and CEO of Siemens Digital Industries. "This exciting collaboration between two industry leaders is about more than just interoperability and interfaces; it is about creating a truly integrated digital thread that unites product and asset lifecycle management with the business that enables customers to optimize production of products."
Silos between engineering and business have existed in enterprises for decades. This new partnership will help customers to break down these siloes so manufacturers, product design teams and service managers have the information needed to quickly create and manage customer-centric product and service offerings.
"As manufacturers design and deliver smarter products and assets, access to real-time business information across networks is critical to bring new and improved innovations to market faster," said Thomas Saueressig, member of the Executive Board of SAP SE and responsible for SAP Product Engineering. "Bringing together expertise from SAP and Siemens to offer Industry 4.0-enabled business processes allows enterprises to create a digital thread for the entire product and asset lifecycle. With this end-to-end solution, teams across the business network can efficiently work together to design and deliver innovative products productively, profitably and sustainably."
Going forward, both SAP and Siemens will be able to offer new solutions that combine their technologies in order to help companies shorten time to market by leveraging Industry 4.0-enabled data using intelligent assets and products. This will also give organizations the benefit of incorporating customer insights into product development through a comprehensive solution, from product design to service and asset management. As a first step in the partnership, SAP will offer Siemens' Teamcenter® software as the core foundation for product lifecycle collaboration and data management and Siemens will offer SAP® Intelligent Asset Management and SAP Project and Portfolio Management solutions to maximize the business value for manufacturers and operators across networks. Both companies will collaborate to develop applications from an end-to-end lifecycle perspective to help customers achieve a seamless digital thread that improves overall business performance.
"Combining Siemens' Teamcenter and SAP S/4HANA® software provides companies an end-to-end process capability from product design to decommission," said Bob Parker, Senior VP of Industry Research at IDC. "The IT benefits of pre-integration of PLM, ERP, asset management and supply chain applications and the business benefits from having a more resilient response to changing market demand make this a compelling consideration for companies seeking a competitive advantage in the digital economy."
Suggested Items
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.