-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Releases IPC-2581 Revision C for PCB Design
December 1, 2020 | IPCEstimated reading time: 1 minute
IPC-2581C, Generic Requirement for Printed Board Assembly Product Manufacturing Description Data and Transfer Methodology is the eagerly anticipated update of IPC’s widely adopted global standard for PCB design through manufacturing data flow. Revision C introduces groundbreaking new features, automation supporting Industry 4.0, and bidirectional DFX intelligence capability that eliminates the time-consuming back and forth between design house and manufacturers before production can begin.
As technology in the industry progresses, including the latest additive processes with embedded components within the PCB, the IPC-2581 committee of experts has introduced support for the latest technologies, representing every aspect of modern PCB design. Updates include overhauled support for rigid-flex, embedded components, cavities, coins, attenuation parameters, connector ports, pin polarities, edge plating, countersink/counterbore, square drill, and intended net-shorts.
Ensuring that all related data is in digital form, IPC-2581 represents the method of choice for automation between design and manufacturing, significantly surpassing proprietary and legacy formats.
As a specific highlight, revision C includes the bi-directional DFX data exchange through which feedback between design and manufacturing is conveyed and tracked before manufacturing begins.
“DFM checking and resolution can be a frustrating and time-consuming process that poses little overall benefit for our customers” said Greg Link, FAE manager for WUS Printed Circuits. “IPC-2581 revision C addresses the need for a collaborative, executable exchange for DFM issues eliminating spreadsheets, PowerPoints, and emails, accelerating new product introduction for our customers."
“As the industry continues to move toward digital data exchange, the timing is right for the technology behind IPC-2581C to bring the opportunity for critical savings and efficiencies in engineering workload. The update benefits both design and manufacturing, supporting agility and responsiveness within the holistic electronics manufacturing process,” stated Matt Kelly, IPC chief technologist.
“IPC-2581C is also a major component of the digital twin architecture and strategy, setting the standard for interoperability between different digital twin solutions, bringing maximum value from data,” Kelly added. “IPC-2581 revision C is much more than an incremental update, providing the industry’s only fully digitalized and automated data exchange. It is ready to be a critical part of any PCB fabrication and assembly manufacturing smart factory strategy.”
Suggested Items
MKS’ Atotech, ESI to Participate in IPC APEX EXPO
03/29/2024 | MKS’ AtotechMKS’ Atotech and ESI will participate in this year’s IPC APEX EXPO 2024, the PCB industry’s largest event in North America, to be held in Anaheim, California, to be held from April 6-11 2024 at the Anaheim California Convention Center.
Cogiscan Collaborates with Koh Young to Unveil How Factory Insights Software Transforms Data Into Action at IPC APEX EXPO
03/28/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, is excited to announce Factory Insights, the latest offering from Cogiscan, will be demonstrated alongside KSMART in Koh Young booth 2112 during IPC APEX Expo.
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
03/27/2024 | SEMIMore than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York.
NextFlex Announces $5M Education Fundraising Effort: First Spotlight - Transforming the Landscape for Women in Technology
03/27/2024 | BUSINESS WIRENextFlex Learning Programs, the education-focused arm of the NextFlex® Hybrid Electronics Manufacturing Innovation Institute, announces its first spotlight effort, “NextFlex Supports Women in STEM” to increase the number of women in STEM fields, which could accelerate U.S. GDP growth by boosting women’s cumulative earnings by $299B and adding $5.9T to the global stock market within 10 years according to S&P Global.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.