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New I-007eBook Highlights SMT Inspection: Today, Tomorrow, and Beyond
March 11, 2021 | I-Connect007Estimated reading time: 1 minute
Increasing board complexity is driving the need for accurate and speedy inspection systems. In The Printed Circuit Assembler’s Guide to SMT Inspection: Today, Tomorrow, and Beyond, author Brent Fischthal takes readers through a brief history of SMT inspection before discussing the benefits of data-driven analytics and how intelligent software solutions can help companies analyze and optimize the production process.
In this latest title from I-007eBooks, readers will learn how artificial intelligence has demonstrated promising potential in this field and has far-reaching applications within the manufacturing sector.
According to Michael Ford, Senior Director of Emerging Industry Strategy for Aegis Software, “This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection.”
Download your free copy today!
You can also view other titles in our full library. The Printed Circuit Assembler’s Guide to… series is specifically dedicated to educating the printed circuit board assembly (PCBA) sector and serves as a valuable resource for people seeking the most relevant information available.
We hope you enjoy The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-8)
Suggested Items
American Made Advocacy: Going Beyond the CHIPS Act to Power American Manufacturing
03/26/2024 | Travis Kelly -- Column: American Made AdvocacyWhere have all the factories gone? A tour of America’s former bustling manufacturing communities is a stark reminder that, for the past three decades, we let the microelectronics manufacturing ecosystem disappear overseas, primarily to Asia. For decades, foreign competitors seeking to control critical markets played a long game. Government investment and subsidies were effective in undercutting U.S. and European companies. As other countries created this unfair competitive advantage in manufacturing, the know-how also migrated in their direction. This resulted in the serious workforce challenges the semiconductor and printed circuit board industries face today.
Dave Brooks Celebrates 25 Years at IEC USA
03/26/2024 | IECPlease join IEC (International Electronic Components) in congratulating Dave Brooks on 25 years of service and camaraderie. As one of the original members of the IEC USA team, Dave is a valuable contributor to IEC's continued success.
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
03/27/2024 | I-Connect007I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.
Green Circuits Unveils Innovative Stacked Capacitors Assembly Process
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Happy’s Tech Talk #26: Balancing the Density Equation
03/14/2024 | Happy Holden -- Column: Happy’s Tech TalkPrinted circuit design and layout is a creative process that has profound implications for electronic products. With the need for more parts on an assembly, or the trend to make things smaller to be portable or for faster speeds, the design process is a challenging one. The process is one of “balancing the density equation” (Figure 1) with considerations for certain boundary conditions like electrical and thermal performance. Unfortunately, many designers do not realize that there is a mathematical process to the layout of a printed circuit