-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IDEX Biometrics Further Strengthens its Supply Chain by Partnering with MFLEX
March 3, 2021 | Globe NewswireEstimated reading time: 1 minute
IDEX Biometrics ASA, a leading provider of advanced fingerprint identification and authentication solutions, has signed an agreement with Multi-Fineline Electronix, Inc. (MFLEX), a subsidiary of Suzhou Dongshan Precision Manufacturing Co., Ltd. (DSBJ), and a leading global provider of high-quality, technologically advanced flexible printed circuits and assemblies. The agreement forms a key part of IDEX’s mass production ready supply chain, essential to meet the growing demand for biometric payment cards.
Under the agreement, MFLEX will provide flexible printed circuit assemblies for IDEX’s biometric payment card reference design. This reference design is the only biometric smart card reference design that has been used in cards certified by China UnionPay. MFLEX has received an initial order from a Tier 1 card manufacturer.
“Developing an end-to-end supply chain for biometric card manufacture is critical to accelerating the development of biometric cards by card producers,” said Reza Meshgin, CEO, MFLEX. “This allows card manufacturers to focus on their competences such as lamination, embedding, and personalization, and streamlines the card development and go-to-market processes.”
“As we establish a supply chain that is mass-production ready, we are pleased to have signed this agreement with MFLEX, a global leader in its field. This agreement allows card manufacturers to have instant access to high-quality flexible printed circuit boards in the required large quantities,” said Vince Graziani, CEO, IDEX Biometrics.
Suggested Items
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.