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TRI to Showcase AI-powered Inspection Solutions at NEPCON China 2021
March 25, 2021 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON China held at Shanghai World Expo Exhibition & Convention Center from April 21-23, 2021 to feature Innovative SMT Inspection solutions for the Smart Factories. Visit booth #1J40 to experience Smart Factory Inspection Solutions in action.
Join TRI at NEPCON China 2021 to discover the new "AI Station" capable of 24/7 inspection optimization using deep learning, reducing human errors, false calls, and operator costs.
TRI will be showcasing the newly released 3D SPI TR7007Q Plus. The new 3D SPI is equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. Also exhibiting will be the AI-powered 3D AOI TR7700Q SII with unprecedented 1?m Resolution for High Accuracy, industry-leading speed of up to 57cm2/sec, and flexible algorithms. TRI's lineup will also include the high-end 3D AXI TR7600F3D SII and the Multi-core ICT TR5001Q SII INLINE.
Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload.
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Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
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Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.