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KIC to Exhibit at the SMTA Dallas Expo
February 24, 2022 | KICEstimated reading time: Less than a minute
KIC will exhibit at the SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 22, 2022 at the Plano Event Center.
KIC has thermal process solutions for NPI process setup, automatic profiling and data reporting, easy process audits, process traceability, MES/CFX connectivity and more.
Electronics manufacturing today requires automated and real-time process control and traceability. KIC provides solutions for real-time inspection of the reflow/cure/wave process, like SPI and AOI provide optical inspection for printing and placement.
KIC will display the latest addition to the thermal process inspection family – the award-winning Wave Process Inspection system. As the RPI does for reflow, wave process inspection (WPI) provides users with automatic profiling -- including an industry first dwell time and parallelism measurement for each production board -- real-time preheat and wave analytics, automatic SPC charting and more.
For 45 years KIC has provided solutions for automated thermal process data collection and analytics, with service and support offices in every region. As the market leader and industry standard, there are more than 25,000 systems in the field bringing value and the most reliable, accurate and innovative solutions for electronics manufacturing thermal process challenges.
Suggested Items
The Connection Between Wire Harness and Box Build
04/17/2024 | Nolan Johnson, I-Connect007Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.
NetVia Group Acquires Direct Imaging from Mivatek
04/09/2024 | Miva TechnologiesMiva Technologies is pleased to announce NetVia Group, Irving, TX has acquired a new Miva 2400NG Dual Tray Direct Imaging System with 30-micron capabilities for inner, outer and soldermask imaging.