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Next-Gen Stencil Cleaners from KYZEN at SMTA Chihuahua
July 27, 2022 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, Aug. 25, 2022 at the Sheraton Chihuahua Soberano in Chihuahua, Mexico. The KYZEN team will showcase the award-winning KYZEN® E5631 and E5631J Next Generation Stencil Cleaners as well as CYBERSOLV C8882.
E5631-E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints. The stencil cleaner is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil and ultrasonic systems.
The stencil cleaner was formulated to operate at low concentrations (<25 percent) while remaining a top performing product. E5631 provides superior and exceptional cleaning of ALL widely used assembly materials. Additionally, it rinses easily and completely thus reducing typical dry time.
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.
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AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.