-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Wistron, Purdue University Signed a Cutting-edge Technology Research Plan
August 22, 2022 | WistronEstimated reading time: 1 minute
Wistron Corporation announced signing a cutting-edge technology research plan with Purdue University. Both will cooperate on open edge computing and smart manufacturing related applications, while jointly developing decentralized processing systems that can be used in smart factory management platforms.
Wistron and Purdue University started cooperation negotiations in 2021. After in-depth discussions on the direction and implementation of the research plan, a consensus was reached in mid-2022, and a master agreement in cooperation was signed afterwards. Wistron and Purdue will formulate substantive research subjects under this framework. Wistron will invest in R&D and talents in the next three years to jointly promote research for the next generation edge computing platform with Purdue University.
Simon Lin, Chairman of Wistron, said: "Wistron always devotes to promoting advanced technology research, and has continuously collaborated with the best global universities, experts, and scholars. This research collaboration with Purdue University shows that Wistron’s continuous growth stems from not only the R&D transformation inside the company but from also working with excellent institutes and talents in and outside Taiwan, making breakthroughs in technologies, accelerating digital transformation, and building technological competitiveness. Through research collaboration, Wistron can expand its reach in the United States, participate in technology alliances, and access the latest information in the industry."
Dr. Mung Chiang (Purdue University President-Elect, formerly John A Edwardson Dean of College of Engineering) is the project director of this cooperation program. He states: " We are excited about the new research collaboration between Purdue and Wistron, one of the largest tech companies in the world on the edge of innovation today. We thank Wistron’s chairman, Simon Lin, for his visionary leadership in making this collaboration a reality. These research projects will accelerate our joint effort in advanced manufacturing, cyber security and edge computing.”
According to Wistron, the results of this research plan will contribute to the development of Wistron's new businesses in the future, and a R&D team will be established by recruiting local professional talents. Furthermore, Wistron will support talents expected to contribute to society as well as technology development by offering scholarships to two or three Taiwanese students studying at Purdue to join the research projects.
Suggested Items
Absolute EMS Champions Collaboration Between Humans and Robots in Modern Manufacturing
04/19/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, offers a perfect factory environment that seamlessly blends robotic automation with human expertise.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.