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Indium Introduces New Talent Acquisition Supervisor Nate Discavage
September 29, 2022 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation is pleased to announce that Nate Discavage has joined the company as a talent acquisition supervisor.
In this role, Discavage is responsible for developing improvements for recruiting and attracting top talent, engaging in strategic community outreach activities to develop contact with groups and organizations. He also manages Indium Corporation’s award-winning internship program, and implements diversity recruiting strategies consistent with Indium Corporation’s affirmative action plan and objectives.
Prior to joining Indium Corporation, Discavage was a recruiter at the Resource Center for Independent Living (RCIL). During his time with RCIL, he helped rebuild their recruitment approach, adding structure and processes to streamline the hiring timeline and ensure a positive candidate experience.
Nate earned a bachelor’s degree in journalism and mass communications from St. Bonaventure University. He currently serves on the City of Utica’s Access & Inclusion Committee.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007eBooks library.
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AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.