-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC, European Parliament Work to Bolster European Chips Act
October 6, 2022 | IPCEstimated reading time: 1 minute
The Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging.
That’s good news for the electronics industry given the important role that MEP Maydell plays in the European Parliament’s ongoing deliberations on the Chips Act. She is the EPP Group Rapporteur on the Chips Act and the Rapporteur on the Chips Joint Undertaking.
In her remarks to IPC members, she noted that Europe commands only 5% of packaging capability globally, a percentage that will need to increase given the criticality of advanced packaging for performance as well as lower energy consumption. Always a champion for innovation, she also offered to continue to work with IPC and the European electronics industry in the lead-up to her draft report on the Chips Joint Regulation.
IPC has been in touch with MEP Maydell and with many of her colleagues to bolster the Chips Act by providing:
- A definition for advanced packaging that includes assembly and test, IC substrate fabrication, and embedded components
- Greater affirmative support for investments in advanced packaging R&D and industrial capacity
- Greater articulation that the Chips Act is the 1st step in a process of strengthening Europe’s electronics manufacturing ecosystem.
IPC is working with our members and industry peers to secure greater support within the European Parliament.
Suggested Items
IMI Taps New Opportunities to Sustain Grit in China
03/28/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI), Joey S. Bantatua, IMI China’s head of operations and general manager was recently interviewed by Asia Electronics Industry (AEI) magazine where he talked about the prospects of the country both as a market and a production hub.
Kimball Electronics Publishes Annual Sustainability Disclosures with its 2023 Guiding Principles Report
03/28/2024 | BUSINESS WIREKimball Electronics, Inc. published its annual sustainability disclosures in its 2023 Guiding Principles Report, themed “How We Are Winning Together The Kimball Way.”
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.