-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young Speaking on Combining DPMX with CFX will Streamline Electronics Assembly
October 25, 2022 | Koh YoungEstimated reading time: 1 minute
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will discuss the benefits of combining IPC-DPMX with IPC-CFX to deliver data directly to machines and streamline the process. Mr. Ivan Aduna, Global MES Manager at Koh Young America, will present the whitepaper on Thursday, 03 November 2022, during the MFX5 Smart Factory & Automation Technical Session during SMTA International in Minneapolis, Minnesota.
The paper, a collaboration with Michael Ford from AEGIS Software and Hemant Shah, the IPC-DPMX Consortium Chair, will outline how to securely exchange data between design and manufacturing areas by using the Digital Product Model Exchange (IPC-2581 DPMX) and Connected Factory Exchange (IPC-2591 CFX) standards. This combination will help electronics manufacturers improve efficiency, security, and costs.
IPC-DPMX is a standard for transmitting information between a printed circuit board designer and a manufacturing or assembly facility. For nearly every step in the process, IPC-DPMX offers a standard to help companies ensure superior manufacturability, quality, reliability, and consistency. IPC-CFX is an industry-developed open standard forming the backbone of a smart factory. IPC-CFX is a plug-and-play solution that simplifies and standardizes machine-to-machine communication, while helping machine-to-business and business-to-machine applications.
Traditionally, it could take days for manufacturers to compile the necessary files needed for production. Worse, the outdated formats may exclude critical elements like stack-ups, materials, design intent, and more. With IPC-DPMX, what took days, now takes minutes thanks to an intelligent data exchange. “The IPC-DPMX and IPC-CFX combination provides production flexibility and security while driving the movement towards Industry 4.0,” said Ivan.
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
Suggested Items
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
It’s Only Common Sense: OCCAM—the Time Is Now
04/22/2024 | Dan Beaulieu -- Column: It's Only Common SenseOne of my favorite books is a little tome called Who Moved My Cheese? Even those of you who don’t spend a lot of time reading books have at least heard of it and know that it refers to people, especially in business, who are so stuck in their ways that they get upset when something changes. In our business, we know this kind of thinking is especially true. In fact, it always makes me laugh when one of my innovative friends finds a new way to do something and is afraid that someone will steal his idea. I always tell him that no one in our business, especially a PCB engineer, has ever thought about someone else’s innovative idea enough to steal it.
Digitalisation and ESG
04/19/2024 | Marina Hornasek-Metzl, AT&SDigitalisation and ESG are prominent and high-priority topics in the global business community. The first focuses on applying technology throughout the value chain to produce faster, smarter, and more desirable business outcomes. The latter emphasises the broader value a business is expected to create for its stakeholders from an environmental, social, and governance perspective.
Real Time with... IPC APEX EXPO 2024: Looking Back, Looking Forward With IEC
04/19/2024 | Real Time with...IPC APEX EXPOIEC came to the RTW booth and discussed both the legacy of IEC's past and the vision for its future. Industry veteran Bruno Ferri highlighted his quarter-century tenure in the industry and with IEC since its founding. He still exhibits boundless enthusiasm for the industry. Brando Stone, a young professional and a future face of IEC, talked about IEC's plans going forward and his experience at this year's IPC APEX EXPO.