-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX
December 15, 2022 | Nihon Superior Co. Ltd.Estimated reading time: 2 minutes
Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Nihon Superior’s TempSave™ series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.
High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, a high speed jetting paste version is available, TempSave B37 P611 which provides consistent dot sizes.
LF-C2 P608 is a completely halogen free, lead-free, low voiding solder paste. The demand of the automotive industry for solder alloys that deliver long life in conditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deformation that drives failure in thermal cycling, the trade-off is that their hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, delivering long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.
SN100CV® P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305.
The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 P608 both deliver excellent performance over a wide range of component types and process parameters.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.