-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young Honored with Multiple Product Awards at IPC APEX EXPO
January 23, 2023 | Koh YoungEstimated reading time: 1 minute
Koh Young Technology, the industry-leader in True 3D measurement-based inspection solutions, is proud to announce the industry recognized two of its new electronics inspection innovations by awarding them the acclaimed New Product Introduction (NPI) Award from Circuits Assembly during IPC APEX EXPO. The first award is for our KPO Printer that uses Artificial Intelligence to make print process decisions without process engineering expertise. Circuits Assembly then presented Koh Young its second award for the Neptune C, which provides manufacturers with a technology path that can ensure the equipment remains useful as requirements change.
KPO Printer
Product miniaturization is driving smaller apertures, finer solders, and complex designs, which makes printing a sophisticated process with significant impact on yield. Typically, print process expert must constantly adjust print parameters to ensure a stable process. Yet, Koh Young is creating an autonomous, connected electronics manufacturing environment for defect-free production using its growing suite of AI-powered process optimization tools. KPO Printer (Koh Young Process Optimizer for Printers), which uses a proprietary Artificial Intelligence (A.I.) engine we developed locally to help machines solve print process challenges. KPO Printer exercises complex algorithms to diagnose issues, recommend parameters, and improve print quality.
Neptune C
With today’s tight margins, component scarcity, and labor shortages, production yield is more important than ever, yet limited budgets and diminished resources are pressing manufacturers to skimp on equipment and make “good enough” purchases – ignoring future needs. What happens when the process changes or customer demands increase? What happens when a new contract requires advanced inspection? Unfortunately, they have obsolete equipment. Enter “future-proofing” – the ability to remain valuable into the future without becoming obsolete. The new, cost-effective Neptune C for dispense process inspection (DPI) allows manufacturers to secure fundamental coating inspection with a minimal investment. When the process changes (as they always do), the manufacturer can field-retrofit our L.I.F.T. technology (Laser Interferometry for Fluid Tomography) for non-destructive True3D inspection. Besides coatings, it measures under?ll, epoxy, bonding, and other materials. With Koh Young, manufacturers are not just future-proofing their investment, they are future-proofing their business.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).