-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young Technology is Exhibiting at the 2023 IEEE Electronic Components and Technology Conference
May 2, 2023 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young, the industry leader in True3D measurement-based inspection solutions, is excited to exhibit in booth 134 at the at the 2023 IEEE Electronic Components and Technology Conference from 30May to 02June 2023 in Orlando, Florida at the JW Marriott Orlando, Grande Lakes.
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. IEEE Electronics Packaging Society is sponsoring the 73rd ECTC.
The technical program includes papers covering leading edge developments and technical innovations across the packaging spectrum, including topics like assembly and manufacturing technology, advanced packaging, as well as emerging technologies in both poster and presentation formats. The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants with the opportunity to gain the insight and perspective of technical and business leaders.
“Whether an engineer, manager, student, or executive, ECTC offers something unique for everyone in the microelectronics packaging and components industry. I invite you to make your plans now to join us and to be a part of all the exciting technical and professional opportunities,” commented Mr. Florian Herrault, 73rd ECTC Program Chair. “I also want to thank our sponsors, exhibitors, authors, speakers, PDC instructors, session chairs, and program committee members, as well as all the volunteers who help make ECTC a success.”
The 2023 ECTC Exhibition complements the strength of the ECTC technical program with an opportunity for engineers and decision makers to collaborate with Koh Young and other packaging companies. Exhibit hours will be from 9:00am to 12:00pm and then again 1:30pm to 6:30pm on Wednesday, May 31, 2023. The second day of the expo is from 9:00am to 12:00pm and 1:30 to 4:00pm. Visit us in booth 134 to discuss your inspection or application challenge. “With our market-leading, AI-powered complement of inspection machines designed to reduce waste with zero-defect production via automated process control and optimization, we have the expertise and solutions to help manufacturers improve their processes,” remarked Brent Fischthal, the Senior Manager for Americas Marketing at Koh Young.
Suggested Items
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Orbex Secures £16.7m Investment for Rocket ‘Ramp Up’ Period
04/24/2024 | OrbexThe UK spaceflight company Orbex has received £16.7m from six backers in an update to its Series C funding round.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Real Time with... IPC APEX EXPO 2024: Advancements in Laser Depaneling with LPKF
04/24/2024 | Real Time with...IPC APEX EXPOJake Benz, LPKF sales manager for North America, discusses the company's advancements in laser depaneling. LPKF has introduced a green wavelength laser for processing rigid FR-4 circuit boards, bringing significant gains in processing speeds to market. The company transitioned from IR CO2 to UV wavelength due to heat and burning issues.
Adura Solutions Exhibits at Del Mar 2024
04/24/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year’s Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.