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Mycronic Receives Order for Prexision 8 Evo and Prexision Lite 8 Evo
May 17, 2023 | Mycronic ABEstimated reading time: Less than a minute
Mycronic AB has received an order for a Prexision 8 Evo and a Prexision Lite 8 Evo from an existing customer in Asia. The order value is in the range of USD 31-34 million. Delivery of the Prexision 8 Evo is planned for the first quarter of 2025, while the Prexision Lite 8 is planned for delivery during the fourth quarter of 2024.
Prexision 8 Evo meets the market’s requirements regarding complex patterns for display photomasks. Prexision Lite 8 Evo is designed to meet the requirements for cost-efficient production of photomasks for displays.
“The order for a Prexision 8 Evo forms part of our replacement program. The fact that it is placed together with an order for a Prexision Lite 8 Evo means that our customer increases capacity to cost efficiently produce both complex and less complex photomasks for the display industry”, says Charlott Samuelsson, Sr VP Pattern Generators at Mycronic.
Mycronic’s Pattern Generators division provides mask writers for display manufacturing and production of semiconductors.
Suggested Items
The Many Complexities of PFAS
03/26/2024 | Marcy LaRont, PCB007 MagazineIn its simplest definition, PFAS is a group of chemicals used to make fluoropolymer coatings and products that resist heat, oil, stains, grease, and water. Fluoropolymer coatings can be in a variety of products. Though this definition is not inaccurate, it can be misleading. Depending on who you ask, there are upward of 10,000 PFAS chemistries that can meet various definitions.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
Altair SimSolid Transforms Simulation for Electronics Industry
03/22/2024 | AltairAltair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.
Green Circuits Unveils Innovative Stacked Capacitors Assembly Process
03/21/2024 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.
Sondrel Announces Two New Design Contract Wins
02/29/2024 | SondrelSondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.