-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dorigo Systems Installs Koh Young 3D SPI, AOI Inspection Systems
July 23, 2015 | Koh Young TechnologyEstimated reading time: 2 minutes
Canadian Pacific Northwest EMS leader Dorigo Systems has installed Koh Young KY8030-3 SPI and Zenith 3D AOI systems in their newest SMT PCBA manufacturing line, adding 3D measurement and inspection capability for printed solder paste (SPI) as well as completed SMT assemblies (AOI). Both systems are intended to optimize productivity and ensure product quality through process optimization through Koh Young’s patented measurement and inspection technologies. Dorigo is a thriving EMS provider with two manufacturing facilities totaling over 45,000 square feet located in Burnaby, British Columbia, Canada.
The combination of KY8030-3 SPI and Zenith AOI inspection solutions provides comprehensive defect prevention and yield improvement tools for Dorigo Systems to ensure that optimum quality is built into their products. Koh Young is the market leader for full 3D Solder Paste Inspection (SPI) and 3D Automated Optical Inspection (AOI) of SMT PCB assemblies.
“At any given time, we typically have over 300 open production jobs at our two operating plants, utilizing a wide variety of processes and equipment, and servicing the production requirements of more than 30 active customers,” says Mark Pillon, P. Eng., company President.. “It’s essential that our production process is optimized so that we can ship the highest quality defect-free product all the time with minimal process issues in our high-mix environment. We’re confident that these new Koh Young systems will help our production maintain its competitive edge.”
Koh Young’s KY8030-3 true 3D SPI measurement system provides full patented 3D measurement for the complete range of solder paste measurement and inspection across a wide measurement range while ensuring accuracy without sacrificing resolution.
With its authentic 3D measurement capability, Koh Young’s Zenith AOI system can detect all types of defects with real measurement values, allowing much easier defect evaluation and process control.
About Koh Young Technology
Koh Young Technology specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Europe, Japan, Singapore, China (Shenzhen) and Korea. For more information about the company, visit www.kohyoung.com; contact the main office at 6150 W. Chandler Blvd., Suite #39, Chandler, AZ 85226. Office Tel: (480) 403-5000.
About Dorigo Systems Ltd.
Dorigo Systems is one of the Pacific Northwest’s leading contract manufacturers of Printed Circuit Board Assemblies (PCBAs). Dorigo’s mission is to manufacture the highest quality electronics using fast turnaround and dedicated service capabilities. Dorigo cost-effectively takes a customer’s product from prototype to full production, and Dorigo’s state-of-the-art circuit board manufacturing, can handle the most complicated and demanding projects. Contact the company at 3885 Henning Drive, Burnaby, BC V5C 6N5 Canada, Tel: 604-294-4600, email sales@dorigo.com or visit www.dorigo.com for more information.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.