-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha to Feature Preforms Sintering Technology at APEC POWER EXPO 2016
February 9, 2016 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, plans to feature the ALPHA Argomax Ag sinter product range at the 2016 APEC show, booth #1561, to be held in Long Beach, California from March 20– 24.
Alpha will demonstrate its new Argomax® 9000 Silver Sintering Preforms which is a world first for the Power Semiconductor Industry. These innovative preforms deliver superior thermal conductivity, ultra-high reliability and excellent electrical conductivity. They have shown excellent performance in large area attachment and can help to simplify the manufacturing process.
“This year we launched one of our most innovative products, the ALPHA Argomax 9000 preforms”, said Julien Joguet, Alpha’s Global Product Manager for Sintered Materials. “Up until now, ALPHA Argomax has only been available in both paste and film formats, but now we are the first to introduce a sintering product in a preform format to widen our product portfolio and extend the superior capabilities of Argomax”.
Argomax 9000 preforms are proving to the most reliable die attach materials on the market. It can be used in a range of applications from power modules to Automotive applications, in areas in which thermal and electrical conductivity and joint strength is crucial. The preforms are available for sampling in tape and reel format and waffle pack for standard pick and place equipment.
To learn of other “Alpha firsts” in the semiconductor industry, please visit us at APEC, Booth #1561 and discover the multiple manufacturing process options that ALPHA Argomax offers.
Suggested Items
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.