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Microtronic to Intro Heavy Duty Solderability Tester at SMT Hybrid Packaging 2017

04/17/2017 | Microtronic GmbH
Microtronic GmbH will introduce its new LBT210-HD (Heavy duty) Solderability Tester in Stand 221J in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.

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Microtronic has appointed DISTEK Microelectronics as its representative throughout Italy.
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