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High Performance Methyl Methacrylate Adhesives from Intertronics
February 11, 2016 | IntertronicsEstimated reading time: Less than a minute
The new adhere series of two-component methyl methacrylate adhesives offers primerless, superior-strength bonds on most metals, thermoplastics and composites with fast room temperature cure times in the order of 9-15 minutes. This speed of cure is of great benefit in short cycle time production schedules where these high strength, lightweight adhesives produce durable, high impact structural bonds for a wide range of manufactured products. They are resistant to weathering, salt spray and QUV radiation, as befits their development in the automobile industry where they are used worldwide in the production of plastics assemblies.
The benefits of IRSL&L A-K083 and A-K085 high performance adhesives are now available to the wider manufacturing arena through Intertronics, with this series available in clear and black. They are convenient and easy to use (with a mix ratio of 1:1) on most metals, thermoplastics and composite substrates, including carbon steel, stainless steel, electrogalvanized steel, hot dip galvanised steel, Aluminium, ABS, fibreglass and sheet moulded composite. In addition, they are non-flammable and low odour with low shrinkage.
Suggested Items
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.
TSMC Arizona, U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding
04/09/2024 | TSMCTSMC announced that the U.S. Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding under the CHIPS and Science Act.
iNEMI Announces Results of Board of Directors Election
04/08/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces results from its recent Board of Directors election. The consortium's members have added three new directors and re-elected three incumbents, effective April 1, 2024.
IPC APEX EXPO 2024: LPKF—Debunking Depaneling Industry Perceptions
03/27/2024 | Nolan Johnson, I-Connect007In this audio interview, listen to Jake Benz discuss advances in laser depaneling at LPKF. Thanks to advances in laser technology, perceptions about laser depaneling are changing from a low-speed, specialized process to a high volume process suitable for production manufacturing. Benz elaborates on some of the development and engineering that went into creating their latest, most capable depaneling machines.
Seeking Employment: Meet Gary Turner
03/25/2024 | Barry Matties, I-Connect007Meet Gary Turner, a recent graduate from the University of Texas at Dallas with a bachelor’s degree in mechanical engineering and a master’s in material science and engineering. He is currently seeking employment in the industry. The following interview will allow you to learn about Gary and see if he might be a good candidate for a position you are looking to fill.