-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Mek will Showcase Its Widest Ever Range of AOI Offerings at IPC APEX 2016
February 26, 2016 | Mek (Marantz Electronics)Estimated reading time: 2 minutes
Mek (Marantz Electronics), will showcase its most comprehensive range of AOI systems in the company’s history at the forthcoming IPC Apex Expo in Las Vegas on booth #965.
The new Mek SpiderEye is a static AOI system for the automated inspection of moving objects. It features eight, high frame rate colour cameras operating simultaneously, each with their own controlled LED light source. All image capturing devices are controlled by proprietary, state-of-the-art electronics and programmed by a single computer and controller with the same 22X powerful software engine as Mek AOI machines. Mek SpiderEye utilises just a single software interface to control and program all eight cameras – no need for multiple inspection programs.
Mek’s desktop solutions offer benchtop PCB inspection with exceptional defect coverage. The new iSpector is an entry level machine for manufacturers requiring high-quality AOI with a low price tag. Providing a rapid, repeatable inspection process at an affordable cost, it’s a plug-and-play installation with iMentor online training and is exceptionally easy-to-program.
Among the other product highlights is the SpectorBOX “Bottom-Up / Top-Down” Modular AOI system uniquely engineered to accommodate solder frames on return and/or feed conveyors. SpectorBOX offers bottom side, top side or simultaneous dual side inspection, deploying up to 18 cameras, Z axis positioning and auto-focus. Optimized for the inspection of THT components to identify defects such as presence/absence, wrong polarity, colour, type, and bent pins, now, the unique top clearance of 130mm (5.12”) allows the Top Down SpectorBOX to inspect virtually any completed electronic and electro-mechanical assembly -- even when the tallest of components are present.
Mek’s flagship PowerSpector AOI will also be featured on the booth. The PowerSpector AOI stands out in situations where production quality is the top priority. It reliably inspects SMT and THT component bodies for presence/absence, type, polarity, offset, text, colours etc. and components’ solder fillets for excessive, insufficient or no solder, shorts, and lifted leads. Combined with Catch yield enhancement software, Mek PowerSpector AOI is a completely closed loop, powerful process monitoring and quality control tool.
About Mek (Marantz Electronics Ltd)
A former division of Marantz well known for its high quality Audio/Video products, Mek Japan (Marantz Electronics Kabushiki Kaisha), developed its first AOI system in 1994. Developed to inspect PCB assemblies for correct component placement and soldering, the company’s original AOI system was designed for use in Marantz factories. Proving to be a highly successful, cost-effective alternative to traditional human inspection, Mek developed its first generation commercial system in 1996. With a steadily growing installed base, MEK Japan and its European/American headquarters, Mek, have sold over 5000 units worldwide to date. Now well established as a leading force in AOI technologies, the company also manufactures a 5D post-print SPI system which combines 3D and 2D image processing methodologies to deliver unprecedented defect detection. At the beginning of March 2014 the company opened US offices in Las Vegas.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.