-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
EUTECT Develops Regulated Wire Feed for Safe Piston and Laser Soldering
March 3, 2016 | EUTECTEstimated reading time: 1 minute
EUTECT GmbH has developed a process-reliable handling technology for reproducible solder joints with wire-guided processes. The patented Sensitive Wire Feed (SWF) can be freely integrated and used for all applications in assembly and interconnection technology and can be combined with different process modules. It guarantees maximum reproducibility and process reliability precisely during piston and laser soldering.
Reproducible solder joints are the benchmark for all areas of electronic production. That also applies to challenging solder joints in assembly and interconnection technology.
"Our customers repeatedly presented us with the task that they want to apply a specific amount of solder when piston, laser, or induction soldering. Since no sensitive wire feed was obtainable on the market at that time, it was difficult to be able to guarantee this specific amount of solder and process reliability," said Matthias Fehrenbach, managing director of EUTECT.
The SWF feeds wires to process surfaces in a path- and force-monitored manner, thus defining the wire's impact force. The wire feed is stopped when this is achieved. Both the feed and withdrawal of the wire are monitored here. The wire feed's patented action-reaction principle enables this. Wire kinking is avoided using this function; and component and handling tolerances are compensated or detected. Reference points are likewise specified here in order to be able to transport controlled, reproducible amounts of wire.
The wire-reel holder is aligned flexibly so that various wire-reel positions as well as reel diameters can be used in the shortest possible time. The work angle can be freely selected in the process. The wire is stably introduced into the soldering process in a regulated manner using this intelligent sensor technology whereby a maximum of process reliability is constantly guaranteed. The C6 controller can record all of the process steps in this connection, which enables 100% data capture in terms of traceability.
The SWF can be freely integrated and can also be installed in systems not originating from EUTECT. "Many SWF modules have meanwhile been built into non-EUTECT machines," said Fehrenbach. The application doesn't matter here, because the SWF can be combined with arbitrary process modules via the EUTECT system adapter. The SWF is being used both in piston soldering as well as in the increasingly popular laser soldering. The sensitive wire feed can also be used with induction soldering.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.