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Magnetically Aligned Novel ACA Revolutionizes 3D Chip Stacking

02/18/2016 | Dr. S. Manian Ramkumar, Rochester Institute of Technology
The use of anisotropic conductive adhesive (ACA) is not new within the electronics industry; however, drop-in replacements don't exist for lead-based and lead-free solder assemblies. Also, current ACAs require pressure and sequential assembly of components. In this article, Rochester Institute of Technology's Dr. S. Manian Ramkumar writes about a novel ACA that will help revolutionize the packaging industry.
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