-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC & SMTA to Host High-Reliability Cleaning & Conformal Coating Conference
September 2, 2016 | IPCEstimated reading time: 1 minute
IPC — Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, IL. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
The first day of the conference features Cleaning and Conformal Coating Workshops. The morning Workshop will focus on “DFX – Design for Excellence; Focus on DFR-Design for Reliability of Hardware to be cleaned.” The instructor will be Dale Lee, Senior DFX Engineer, Plexus Corporation.
The afternoon Workshop focuses on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.” The instructors will be Doug Pauls, Principal Materials & Process Engineer at Rockwell Collins and Jason Keeping, P.Eng, Corporate Engineering Project Manager, Ruggedized Electronics Sector at Celestica Inc.
The second and third days will feature the Technical Conference. Sessions will be dedicated to the following topics:
- Processes for Achieving Reliability and Ruggedization
- Cleaning Materials, Machines, Rinsing and Process Control
- Conformal Coating for Class 2 and 3 Electronic Assemblies
- Customer Cleaning Challenges and Needs
- Ultra-Thin Nanocoatings in Electronics Assembly Operations Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.
Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.
Click here for theetailed agenda outline.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Hirose Launches Solution Partner Network to Address Changing Design Challenges
05/06/2024 | HiroseHirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.