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Kyzen to Present Paper on BTC/QFN Test Board Design Considerations at SMTAI
September 9, 2016 | KyzenEstimated reading time: 1 minute
KYZEN is pleased to announce that Dr. Mike Bixenman will present the recent paper “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” at SMTA International. The paper is co-authored by Mark McMeen and Jason Tynes from STI Electronics, and will be presented during the Manufacturing Excellence Track during Session MFX7 - Cleaning: New Techniques, on Thursday, September 29, 2016 at 9 a.m.
It becomes necessary from time to time to change materials of construction, manufacturing processes, and process conditions. A soldering material or cleaning agent may become unavailable due to environmental regulation, market forces, or reformulation. Certain conditions require some form of verification and validation that the process meets the Original Equipment Manufacturers (OEMs) quality and reliability specifications.
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies states that validation and verification be confirmed with test vehicles that are representative of the product being produced. Many of the industry standard test vehicles are dated and not representative of current electrical and electronic assemblies.
The purpose of this research is to use a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components. The non-standard test board has features to also study thermal paddle design options and to develop a risk profile. This research will report Surface Insulation Resistance effects at the source of the residue.
Dr. Mike Bixenman, CTO of KYZEN, has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
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04/25/2024 | SMTAThe Surface Mount Technology Association (SMTA) Long Island Chapter is thrilled to announce its 30th Anniversary and Membership Appreciation Event on Wednesday, May 15th, 2024, from 5:30 to 8:30 p.m. EST. The event will take place at Top Golf Long Island-Holtsville, promising an evening of camaraderie, celebration and fun-filled activities.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
SMTA Announces Program for High Reliability: Strategic Technology Advancement Research Forum
04/08/2024 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 2, 2024 in Olathe, Kansas, USA. The event, now in its second year, addresses challenges for electronics manufacturers in the high reliability sector.
SMTA Conducts First UHDI Symposium
03/29/2024 | Marcy LaRont, PCB007 MagazineSMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.
UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium
03/21/2024 | Anaya Vardya, American Standard CircuitsAmerican Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).