I-Connect007 Editor’s Choice: Five Must-Reads for the Week

November 26, 2021 | Nolan Johnson, I-Connect007

If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week. We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”

Happy Thanksgiving From the I-Connect007 Team

November 25, 2021 | I-Connect007

In the United States, the Thanksgiving holiday is a celebration of gratitude and appreciation for the harvest and for the people close to us. Thankfulness, however, transcends just one day of official observance. The fourth Thursday of November is when the U.S. officially celebrates Thanksgiving Day and as we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.



Maggie Benson's Journey: Taking a Team Approach

November 24, 2021 | Ronald C. Lasky, Indium Corporation

Editor’s note: Indium Corporation’s Ron Lasky continues this series of columns about Maggie Benson, a fictional character, to demonstrate continuous improvement and education in SMT assembly. Maggie was working in her...

Standard of Excellence: Great Customer Service is a Two-Way Street

November 22, 2021 | Team ASC, American Standard Circuits

We all enjoy great customer service. Actually, we love great customer service. We love it so much that we are always happy to tell everyone we know when one of our vendors provides us with great customer service. We actually want to...

Knocking Down the Bone Pile: Methods for Underfilled Component Rework

November 17, 2021 | Bob Wettermann, BEST, Inc.

Products such as engine control modules, drones, smartphones, and other handheld communication devices, which are designed for high reliability and require high processing power, often have a BGA or CSP package as the processor....

Test and Inspection Featuring:

  • Test Strategies and Pain Points with Bert Horner
  • Where AI Meets Test and Inspection with Yan Manissadjian, Alexia Vey, and Jesse Dowd
  • Market Changes Require Re-evaluating Your Testing Processes with Bob Neves
  • Research and Development Leads to Biogreen Coatings with Phil Kinner
  • Conformal Coatings and Legacy X-rays with Ed Moll
  • Keysight’s Massively Parallel Board Test with Christopher Cain
Copyright © 2021 I-Connect007. All rights reserved.