Henkel Highlights Pad Printing, Antenna Technologies at LOPEC 2023
January 26, 2023 | HenkelEstimated reading time: 3 minutes
During the upcoming LOPEC trade show on March 1 and 2 in Munich Henkel will display its range of functional material innovations for printed electronics together with its broad ecosystem of partners. In addition to its solution portfolio for smart surfaces and digital healthcare, the company will focus on novel pad printing solutions for antenna applications. At booth 508 in hall B0, Henkel will also offer dedicated focus hours on a variety of different topics to demonstrate the potentials of printed electronics solutions and applications.
“LOPEC is the leading international platform for printed electronics and brings together all relevant global players from research to application,” explained Stijn Gillissen, Head of Printed Electronics at Henkel. “This year we will showcase our expertise with a variety of material innovations and a special focus on novel pad printing solutions for antennas. We will also highlight our partnership network as we strongly believe that close collaborations across the entire value chain are key for future innovations. Together with our ecosystem of partners we aim to further drive printed electronics solutions across industrial markets.”
Henkel is an industry-leading supplier of printed electronics materials and services. The broad Loctite portfolio of functional inks includes silver inks, carbon inks, dielectric and other non-conductive inks as well as silver chloride inks. These materials enable Henkel´s partners to develop printed electronics applications tailored for the specific properties demanded by industrial customers – for example in healthcare, automotive and in consumer electronics.
Pad Printing of antenna applications
During this year´s LOPEC Henkel will present its new materials tailored for printed antennas. The company has developed highly conductive inks that enable the efficient 3D pad printing for a variety of antenna solutions. The newly developed inks can be pad printed directly onto a 3D surface and integrated into the housings, for example of smartphones. To highlight the pad printing technology and to demonstrate its potentials, Henkel will also exhibit pad printing equipment of its partner Teca-Print, to demonstrate the potentials of the technology.
“Pad printing is a proven processing method for antenna applications with advantages in efficiency, design flexibility and sustainability”, explained Aad van der Spuij, Business Development Manager Printed Electronics at Henkel. “In combination with Teca-Prints expertise our novel materials enable innovative printed electronics solutions for integrated antennas, for example in smartphone housings or other 3D shaped devices. The pad printing technology directly responds to the customer demands for further miniaturization or increasing functionalities and offers potentials in markets such as smart watches, semiconductor or automotive electronics.”
Broad portfolio for digital healthcare and smart surfaces
Besides the novel pad printing solutions Henkel will also showcase its growing portfolio for digital healthcare and smart surfaces. Among others, the company will present its novel INKxperience Kit including different sensor technologies for leak detection, moisture level sensing and others that enable professional engineers to explore and experiment with the technology of printed electronics. In addition, Henkel will demonstrate a variety of solutions for automotive such as printed heaters and its newly launched sensor demonstrator for healthcare patches as well as smart diaper applications.
To further underline the importance of collaboration and to foster the exchange with customers and visitors Henkel will organize a variety of focus hours from ecosystem partners at the booth. On each day the company has reserved deep-dive hours for the topics of smart surfaces, digital healthcare, pad printing and antenna solutions and technology partners. During these sessions Henkel partners in the different areas will join the booth and pitch their companies and developments and will be available for the exchange with potential customers.
In addition to the exhibition Melanie Wendrikat, Market Strategy Manager at Henkel for printed electronics, will give a live presentation at the LOPEC Business Conference on February 28 from 04.20 to 4.40 pm. Under the title ‘Less hassle, more innovation – successful IoT sensor solutions with printed electronics’ she will elaborate on new opportunities to integrate smart surface designs via printed electronics being a key enabler to the creation of intelligent surface solutions. The presentation will specifically highlight latest material innovations and applications, as an example for how printed electronics materials in combination with the right ecosystem partners create a new generation of integrated and retrofitted sensors, adaptable to multiple kinds of surfaces, for improved connectivity, monitoring and data-collection.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.