Hyperstone Security Controller S9S Receives FIPS Certification
March 9, 2023 | HyperstoneEstimated reading time: 1 minute
Hyperstone announces its latest security geared controller, the S9S (compatible to host systems up to the SD 7.1 interface), has received two sought after security certifications for its hashing and AES encryption engines. The need for high-level security in the transmission of sensitive data and the prevention of information leakage among government agencies as well as private corporations using industrial-grade storage has dramatically increased in recent years.
The S9S SHA2-256 hashing engine was granted the FIPS-180-4 certification and the AES encryption engine the FIPS 197 for both XTS and CBC modes with en/ decryption with 128 and 256-bit keys.
The AES encryption standard (FIPS-197) is a cryptographic technique recommended for government and industrial use. AES encryption engines utilize the optimized XTS mode specifically to encrypt user data on the NAND flash. “This certification is integral in the design of secure storage systems such as password protected drives, copy protected applications, digital rights management and applications demanding crypto erase functionality, WORM functionality, access control, encrypted partitions and in order to apply for FIPS 140 certifications” adds Axel Mehnert, VP of Marketing and Strategy.
While Hyperstone uses the certified SHA2-256 hashing engine in its firmware verification and secure boot process, the engine is also available alongside the AES engine to customers implementing firmware extensions with the Hyperstone API. This API enables customers to further develop a proprietary firmware and security capabilities of their storage design without disclosing any information. It allows designers of embedded systems to create truly unique, value-added products. The road to a fully certified FIPS-140 system, requires the implementation of at least one FIPS certified algorithm. By integrating Hyperstones S9S controller into a storage design, one automatically meets these requirements while simultaneously having the added potential of the company’s API.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.