DuPont, JetCool Announce Collaboration in Thermal Management for High-Power Electronics
June 20, 2023 | PRNewswireEstimated reading time: 1 minute
DuPont and JetCool Technologies Inc. (JetCool) announced a collaboration to increase adoption of advanced liquid cooling technology, enabling thermal management for semiconductors, data centers and other high-performance computing applications. Together, DuPont and JetCool will introduce a new sales channel that brings JetCool's advanced cooling solutions to semiconductor companies in Taiwan and Singapore.
As the demand for faster computing increases, chips are getting more powerful – and hotter. Without high-performance thermal management technology, hot spots on chips can lead to packages overheating and system failure. The challenge is even greater today as the electronics industry deploys artificial intelligence (AI) and edge computing applications with increased processing power requirements. As a result, sustainable liquid cooling is becoming a key part of the data center and high-performance computing infrastructure.
To address these growing needs in thermal management, JetCool has introduced microconvective liquid cooling® technology, reducing both capital and operational expenses, enhancing processing speeds, and sustainably enabling higher computing density. This patented technology uses arrays of fluid jets directed at hot spots on the most powerful devices to optimize performance. DuPont and JetCool will collaborate to increase access of this technology by leveraging DuPont's global team and long-standing customer relationships in the semiconductor materials business.
DuPont's Semiconductor Technologies business is a global manufacturer of materials for semiconductor fabrication, packaging and assembly, with more than 50 years of industry leadership and close relationships with advanced fabricators and integrators. DuPont's strategic proximity to customers positions the company to help advance adoption of liquid cooling in semiconductor packaging applications with complex thermal challenges, supporting broader industry initiatives to drive progress in sustainability.
"We are thrilled to join forces with DuPont in order to make our liquid cooling solutions more accessible to the market," said Bernie Malouin, CEO of JetCool. "Working together allows us to bring advanced thermal management solutions to customers seeking to reduce power consumption and improve performance in their data centers, semiconductor applications and other high-power computing requirements."
Shashi Gupta, global marketing director, Advanced Packaging Technologies, DuPont, said, "JetCool's microconvective liquid cooling® technology is an exciting innovation for energy efficient, on-package thermal management with broad benefits. DuPont's technical experts work closely with customers and advise them on material and process integrations for 2.5/3D package designs. We look forward to sharing JetCool's technology with customers to enable sustainable thermal management solutions."
DuPont customers can contact their account representative for more information.
Suggested Items
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.