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Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point

05/14/2024 | Real Time with...IPC APEX EXPO
In an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend towards smaller hole sizes.

Breaking High-speed Material Constraints: Design007 Magazine — May 2024

05/14/2024 | I-Connect007 Editorial Team
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine,, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.

Redwire Announces Development of New European-Built Very Low Earth Orbit (VLEO) Spacecraft Platform called Phantom

05/13/2024 | BUSINESS WIRE
Redwire Corporation, a leader in space infrastructure for the next generation space economy, announced Phantom, a new European Very Low Earth Orbit (VLEO) spacecraft platform.

Emerald Technologies Acquires Optimum

05/13/2024 | Emerald Technologies
Emerald Technologies announced its acquisition of Optimum Design Associates, Inc. (Optimum), a leading electronic design and engineering services company. Terms were not disclosed.

iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

05/13/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.
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