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SMTA Announces Program for High Reliability: Strategic Technology Advancement Research Forum
April 8, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 2, 2024 in Olathe, Kansas, USA. The event, now in its second year, addresses challenges for electronics manufacturers in the high reliability sector.
The program features research on various topics related to high reliability manufacturing including process fundamentals, material considerations, metrology, analytics tools, defect mitigation, and more.
A special keynote presentation is scheduled right after lunch featuring speaker Sherry Stepp, KYZEN Corporation. In her presentation titled “Relationships, Integrity, and Technology,” Sherry will explore how technology advances over the last two decades have impacted how people communicate, relate, and interact with each other.
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Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
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BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.