Product miniaturization continues to challenge capabilities in both design and manufacturing in the surface-mount assembly process and has the potential to increase first-pass defects more than ever. Looking at these first-pass defects, time and time again, the solder paste printing process is identified as the largest contributor. This two-part column will look at solder paste release during printing, and how new stencil technologies can reduce first-pass defects.
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.
As PCB assemblers, manufacturing is all about taking data and delivering good working circuit boards. It can be just data, as in full turn-key, data plus some parts, or a partial turn-key or a kitted job. Regardless of whether you're...
When you are manufacturing high-reliability assemblies related to medical industry, it is critical to take a very close look at the assembly process and all other processes that can influence the end-use reliability—even...
There are numerous "gotchas" if the rework technician does not care for components and materials neighboring the component rework area. However, careful planning, shielding, and sometimes removing a neighboring device or...
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