Product miniaturization continues to challenge capabilities in both design and manufacturing in the surface-mount assembly process and has the potential to increase first-pass defects more than ever. Looking at these first-pass defects, time and time again, the solder paste printing process is identified as the largest contributor. This two-part column will look at solder paste release during printing, and how new stencil technologies can reduce first-pass defects.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

December 14, 2018 | Happy Holden, I-Connect007

Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.



Electronic Manufacturing Files: What We Need for PCB Assembly

December 7, 2018 | Duane Benson, Screaming Circuits

As PCB assemblers, manufacturing is all about taking data and delivering good working circuit boards. It can be just data, as in full turn-key, data plus some parts, or a partial turn-key or a kitted job. Regardless of whether you're...

Does Medical Device Reliability Worry You Sick?

December 6, 2018 | Eric Camden, Foresite

When you are manufacturing high-reliability assemblies related to medical industry, it is critical to take a very close look at the assembly process and all other processes that can influence the end-use reliability—even...

Proper Thermal Shielding Yields Highest Rework Results

November 21, 2018 | Bob Wettermann, BEST, Inc.

There are numerous "gotchas" if the rework technician does not care for components and materials neighboring the component rework area. However, careful planning, shielding, and sometimes removing a neighboring device or...

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