SMTA Welcomes New Board Members


Reading time ( words)

The SMTA is pleased to announce its election results for the Board of Directors for the term beginning during SMTA International (September 25 - 29, 2016). Jeff Kennedy, Celestica, Inc., was elected President. Sal Sparacino, ZESTRON Americas, was elected VP Communications. Richard Henrick, Sanmina Corporation, was re-elected as Secretary. Matt Kelly, P.Eng, MBA, IBM Corporation, and Martin Anselm, Ph.D., Rochester Institute of Technology, were re-appointed to the Strategic Development Committee.

Those remaining on the SMTA Board of Directors include: Treasurer, Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.; VP Expos, Debbie Carboni, KYZEN Corporation; VP Membership, Eileen Hibbler, TEK Products; VP Technical Programs, Raiyomand Aspandiar, Ph.D., Intel Corporation; Strategic Development Committee members include: Richard Coyle, Ph.D., Nokia; Tim Jensen, Indium Corporation and Scott Priore, Cisco Systems, Inc.

The SMTA bids a fond farewell to departing President, Bill Barthel, Plexus Corporation, and VP Communications, Michelle Ogihara, Seika Machinery, Inc. They are congratulated for a job well done and given thanks for the years of dedication to the SMTA.

For more information on the SMTA Board of Directors election results, contact SMTA Administrator Tanya Martin: tanya@smta.org or 952-920-7682.

About SMTA

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

 

Share

Print


Suggested Items

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

SMTAI 2019: Happy Holden’s On-the-Scene Report

10/03/2019 | Happy Holden, I-Connect007
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.



Copyright © 2019 I-Connect007. All rights reserved.